PURINTOBAN-JYUKU IV Introduction to Buid-up Printed Wiring board

  • By Tadashi Kobayashi
  • First Printing (Japanese Edition) April 1, 2001
  • First Printing of English Edition March 20, 2002
  • A5 Size 85 Pages


The PWB is the vehicle for the interconnection of devices and components of a very wide range from semiconductor LSI of super fine structures to human maneuverable devices like keyboards and switches. The build-up wiring board is a kind of PWBs and can be considered as a platform of high-density interconnection close to that used in semiconductor technology compared to conventional multilayer PWBs.
The build-up board technology has made a considerable development in the past decade but it is not yet a completed and matured technology. Various build-up processes have been proposed and in actual use in production now. But many new processes and techniques are still being proposed as new techniques of build-up board manufacturing. The development in the technology should be based not on the board manufacturing technology alone but on the requests from both semiconductor technology and the needs of system developers.
This book is prepared not to cover all the details of the present day technology of the build-up PWB manufacturing but to describe plainly the fundamentals of the build-up board technology. Efforts have been made to explain basics of the build-up technology including comparison with the conventional board technology in various aspects, measures to meet the requirements for mounting of rapidly progressing semiconductor devices and issues related to electrical characteristics of PWBs.
This book consists of the main text and notes. The key aspects of the technology are described in the main text and the details of some of important subjects are explained in notes. There are many cases in this book and also in some catalogues without precise explanation to use technical terms and idioms that are not defined yet by JIS and IEC documents. Efforts have been made in this book to use explicitly typical numbers in explanation to assist in understanding of the meaning of terms. Such numbers used in this book could be obsolete and may not be used in present day production lines. Readers are encouraged to confirm the numbers with the actual cases he/she may encounter in production.
This book is planned as to a continuation volume of the book “Introduction to the Printed Wiring Board Technology” I have written. The former book was intended for novice engineers who would face to the PWBs technology for the first time. This book is prepared for the engineers in this field with an assumption that he/she has basic understandings of the technology that is stated in t he previous book. Reference may be made to the previous book to renew understanding of the PWB fundamentals time to time.
Readers may not to try conquer the top of Mt. Fuji starting from 5-Gome area but may endevour to have an overview of the mountain (technology) from 3-Gome to 8-Gome area (3/10-th height to 8/10-th height) of the technology.

March 2002
Tadashi Kobayashi


PURINTOBAN-JYUKU IV Introduction to Buid-up Printed Wiring board