JPCA standards


List



Drill-bit-cassette and Router-bit-cassette for Printed Wiring Board processing JPCA-ME-DC01-2002 2002.06 https://jpca.jp/standards/s014/
Test Method for Halogen-Free Materils JPCA-ES01-2003 2003.08 https://jpca.jp/standards/s001/
Printed Wiring Boards JPCA-PB01-2004

旧RB02・RB03・ML01
2004.06 https://jpca.jp/standards/s025e/
HDI Printed Wiring Boards JPCA-HD01-2003  2004.09 https://jpca.jp/standards/s016e/
Detail Specification for Optical Board Connector type SF using glass Fibers JPCA-PE03-01-01S-2003 2005.04 https://jpca.jp/standards_hikari/standards_08/s023e/
Detail Specification for Optical Board Connector type MF using glass Fibers JPCA-PE03-01-04S-2004 2005.05 https://jpca.jp/standards_hikari/standards_08/s027e/
Generic rules for Optoelectronic Modules/Generic Specification/Generic Specification for Packaging Interface JPCA-PE04S-2004 2005.05 https://jpca.jp/standards_hikari/standards_09/s028e/
Phenol collection method for copper-cladlaminete JPCA-ES07-2007 2007.05 https://jpca.jp/standards/s039/
A test method for copper-clad laminates for printed wiring boards dielectric constant and dissipation factor (500MHz to 10GHz) JPCA-TM001-2007 2007.05 https://jpca.jp/standards/s040/
Halogen-free copper-cladlaminates for printed wiring boards-Paper base,phenolic resin JPCA-ES02-2007 2007.05 https://jpca.jp/standards/s002/
Copper-clad laminates for printed wiring boards-Halogenated modified or unmodified resin system,woven E-glass laminated sheets of defined relative permittivity(equal or less than 3.7 at 1GHz)and flammability(vertical burning test),copper-clad JPCA-HCL01-2008 2009.06 https://jpca.jp/standards/s055/
Standard on Device Embedded Substrate Terminology/Reliability Test/Design Guide-Edition4- JPCA-EB01-2011 2011.06 https://jpca.jp/standards/s065e/
Standard on Device Embedded Substrate Date Format-Edition1- JPCA-EB02-2011 2011.11 https://jpca.jp/standards/s066e/




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