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Standard on Device Embedded Substrate Data Format – Edition 1 –

  • JPCA-EB02-2011
  • 2012年 11月 第1版 第1刷発行
  • A4判 34ページ


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Process of preparation of this standard

Printed wiring board has been used in various equipment including electronic circuits and wide ranges of equipment requiring electronic circuitry. It is expected to expand its applications to wider ranges of applications. However, unification of design, production and tests is not available yet in each step of the process and effective realization of design, effective production process reduction are not realized yet. Effective use of design information of boards necessary in production of boards is now an urgent requirement by means of automation and rationalization of processes. The committee of developing data format of printed wiring boards in JPCA was formed in July 1992. The data format committee has been working to develop
a format applicable to different CAD systems, highly requested by various applications. They developed “JPCA data format specification” in August 1993. The CAD technology then was not widely used yet and communication among printed wiring board manufacturers was not sufficient enough. In 2008, production of device embedded substrates started and 3D CAD to describe the status of device embedding was required in the design stage of the device. Design information of hole formation, appearance test, electric test were necessary to evaluate performance of products. A committee of data format standardization was formed in the committee of device embedded substrate technology in JPCA in July 2011. The new committee is to develop data format for device embedded substrate standard for circuit board, electric test equipment, image test equipment, and assembly equipment together with experts from related manufacturers. The present document, EB02, was developed to supply the required information to the industry and we are also preparing an international standard by proposing this document to IEC (International Electrotechnical Commission).

The main issues of this document are the following two.
1. Data of board CAD and of FUJIKO and both necessary data of production facility and of test equipment producers are compiled to make it possible to unify the necessary information in production as shown in Table 1-1.
2. Data format is formed to make it possible simulation of design, production and characteristics of device embedded substrate. Know-how of realizing total assembly technology is necessary for printed wiring board production technology based on characteristics of device embedded substrate.

Contents
1. Scope
1.1 Purpose
1.2 Applicable range
1.2.1 Product
1.2.2 Process
1.3 Features
1.3.1 Maintenance of device embedded substrate structure
1.3.2 Maintenance of SiP interposer structure
1.3.3 Maintenance of design data with virtual layer of terminal positions of embedded Device(s)
1.3.4 Maintenance of terminal structure and embedded device structure including SiP
1.3.5 Seamless ownership of design data
2 File description
2.1 File description summary
2.1.1 Types of data and their structure
2.1.2 File structure
2.2 3D expression
2.2.1 Coordinates
2.2.2 Position description
2.2.3 Relation between coordinate origin and board position
2.3 Layer concept
2.4 Board data
2.4.1 Layer map information
2.4.2 Device arrangement information
2.4.2. 1 Attribute of device position and arrangement
2.4.3 Basic figure
2.4.3-1 Point
2.4.3-2 Area
2.4.3-3 Line
2.4.3-4 Text
2.4.3-5 Bonding wire
2.4.3-6 Semi-sphere
2.4.3-7 Rectangular prismoid
2.4.3-8 Via
2.4.3-9 Device
2.4.3-10 Group
2.4.4 Net information
2.4.5 Artwork information
2.4.6 Package information
2.4.7 External port information
2.4.8 Internal port information
2.4.9 User expansion information
2.5 Defined data
2.5.1 Layer definition
2.5.2 Land definition
2.5.3 Via definition
2.5.4 Device definition
2.5.5 User expansion definition
3 Terminology
4 Commentary


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