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Printed Wiring Board

  • 規格番号:JPCA-PB01-2004
  • Date of issue: September 2004
  • A4 Size 36 Pages


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1. Scope
2. Terms and Definitions
3. Definition of the PWB
4. Design Rules and Allowance
4.1 Panel and Board Sizes
4.1.1 Board Size (for reference only)
4.1.2 Allowance of Dimensions
4.1.3 Perforation and Slit
4.1.4 V-cut
4.2 Total Board Thickness
4.2.1 Total Board Thickness and its Allowance
4.3 Holes
4.3.1 Insertion Holes and Vias
4.3.2 Datum hole
4.3.3 Assembly hole (a through-hole without wall plating)
4.4 Conductor pattern
4.4.1 Width of conductor pattern and its allowande
4.4.2 Distance between conductors and its allowance
4.4.3 Distance between conductor and board edge
4.4.4 Thickness of an insulating layer
4.5 Printed contacts
4.5.1 Distance between the centers of two adjacent printed contact terminals
4.5.2 Allowance of the terminal width of printed contacts
4.5.3 Shift of the center of printed contacts on front and back sides of a board
4.6 Footprint
4.6.1 Allowance of the distance between the centers of two pads
4.6.2 Allowance of the width of a pad of a footprint
4.6.3 Pad diameter and its allowance for BGA/CSP
4.7 Fiducial mark and the mark for component positioning
4.7.1 The typical form and the size of the f iducial mark and the mark for component positioning
4.7.2 Dimensional allowance of fiducial mark and component positioning mark
4.7.3 Position allowance of the component positioning mark and the footprint
4.8 Interlayer connection
5. Quality
5.1 Gap between conductor and the wall of a component insertion hole or a via
5.2 Positional deviation between conductor layers of multilayer board
5.3 Minimum land width
5.4 Surface Treatment
5.4.1 Gold plating for printed contact
5.4.2 Other surface treatment
5.5 Defects of solder resist
5.6 Symbol mark
5.7 Appearance
5.7.1 Conductor surface
5.7.2 Between conductors
5.7.3 Defects within insulating layers
5.7.4 Routing and drilling
5.7.5 Conductor pattern
5.8 Land
5.9 Pad of a footprint
5.10 Defects in a pad for BGA/CSP mounting
5.11 Printed contact
5.11.1 Printed contact that is to be electrically connected
6. Performance and test methods
6.1 Observation of holes for component mounting and vias
6.1.1 Observation at standard conditions
6.1.2 Observation after thermal shock test
7. Marking, Packaging and Storage
7.1 Marking on a product
7.2 Marking on the Package
7.3 Packaging and Storage
7.3.1 Packaging
7.3.2 Storage
Annex



注文番号 タイトル 販売価格(税別)
在庫状態 数量 単位  
s025e-k 会員価格 ¥1,000
在庫有り
s025e 頒布価格 ¥2,000
在庫有り
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