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Generic rules for Optoelectronic Modules

  • JPCA-PE04S/JPCA-PE04-01-01S/JPCA-PE04-02-01S(2004)
  • Date of issue: April 2005
  • A4 Size 10 Pages


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Generic rules for Optoelectronic Modules
JPCA-PE04S-2004

Contents
1. Scope This standard describes the architecture of standards for optoelectronic modules realizing desired performance of a module that is composed of electronic and optoelectronic components assembled on a board. This standard also specified the numbering system of the standards in the area of optoelectronic modules.
2. Normative References
3. Terms and Definition
4. Standard hierarchy
5. Numbering of Optoelectronic Module Standards
5.1 Symbol for the Optoelectronic Assembly Standard:
5.2 Number for Optoelectronic Module:
5.3 Number for Optoelectronic module substrate/interface:
5.4 Classification of standards:
5.5 Individual Standard:
5.6 Symbols for types of standards:
5.7 Publication year:


Generic Specification for OE-Module Substrates
JPCA-PE04-01-01S-2004

Contents
1. Scope This specification gives general requirements to the substrates for OE (OptoElectric) modules.
2. Normative references
3. Terms and definitions
4. Classification
4.1 Classification by the materials used
4.2 Classification by the mounting
5. Requirements
5.1 Dimensions
5.1.1 Outer dimension
5.1.2 Pattern accuracy
5.1.3 Coplanarity of the surface
5.2 Resistivity to process parameters
5.2.1 Resistance to soldering heat
5.2.2 Resistance to chemicals
5.3 Transmission characteristics
5.3.1 Electric characteristics
5.3.2 Optical characteristics
5.4 Environmental requirements
5.5 Others
5.5.1 Thermal expansion
5.5.2 Flammability


Generic Specification for Packaging Interface of OE-Modules
JPCA-PE04-02-01S-2004

Contents
1. Scope This specification defines the requirements to the packaging interface of optoelectronic(OE) modules that is optoelectrically connected to other circuits in a board. This specification describes the items to be specified for the OE modules for optical connection of OE modules optically within a board in classes of 1) with an optical pig tail, 2) with an optical connector,3) with connection to a waveguide, and 4) with spatial optical signal transmission. The purpose of setting this specification is to clarify the requirements in realizing packaging of OE modules that is composed of both optical and electronic circuits onto a board. This document, however,does not specify the functional interface nor conditions of protocol conditions.
2. Normative references
3. Terms and Definition
4. Classification
5. Requirements
5.1 Dimensions
5.1.1 Outer dimension
5.1.2 Dimension of mounting area
5.2 Characteristics of incident and emitting light
5.3 Dimensional requirements to the structure of an optical connection
5.4 Electrical in- and output characteristics
5.5 Connection and assembly requirement for electrical signal
5.6 Mechanical requirements
5.6.1 Resistance to vibration
5.6.2 Resistance to shock
5.7 Conditions for mounting of an OE module on a board
5.8 Cooling condition
5.9 Service environment
5.9.1 Temperature and humidity requirements for guaranteed reliability of operation
5.9.2 Temperature range for a short term operation with guaranteed reliability
5.10 Flammability
5.11 Environmental conditions
5.12 Transportation and storage
5.12.1 Transportation and packing
5.12.2 Temperature and humidity in storage
5.13 Marking
5.13.1 Marking for the safety of laser products


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